Traditional doping methods can be roughly divided into three classes: doping during growth, doping by diffusion, and ion implantation. Doping with few impurities into one-dimensional

nanomaterials has been achieved already, but controllable and reproducible doping is still difficult to be achieved during growth. Ion implantation is an advanced technique that has been widely applied in material surface modification for nearly 30 years. As a method for industrial application, ion implantation is a controllable and rather exact manner. Compared with conventional www.selleckchem.com/products/pf-03084014-pf-3084014.html doping method, the Stattic ic50 prominent advantage of ion implantation is that almost all elements can be used for implantation and it never draws into any other impurity elements. Lately, focus ion beam (FIB) system has been used to perform ion implantation process [7, 8]. In this method, the position of ion implantation becomes steerable. In this letter, we review literatures on the application of ion implantation on one-dimensional nanomaterials. Vactosertib in vivo Finally,

we report on our work on the photoluminescence (PL) emission property of single CdS nanobelt implanted by N+ ions. CdS nanobelts have been marked by Au markers. Furthermore, the PL emission spectrum of every marked CdS nanobelts has been recorded before ion implantation. The experiment was designed to study the PL emission variation of the same CdS nanobelt after ion implantation. The changes of morphology and structure Damages induced by ion implantation in an irradiated material are very different; they are related to the ion species, energy, fluences, beam current, and target material. All of these factors may impact the amount and type of the produced damage. While at high fluences, nanowires (NWs) have been observed Y-27632 concentration to be bent and even completely amorphous [9, 10]. Under low implantation fluences, it will only create some isolated point defects like vacancies and interstitials. When ions are implanted into the material, collision cascade may occur

during the implantation process. Furthermore, this effect may cause abundant defects; a single implanted ion can create tens of thousands of vacancies and interstitials in the target materials [11]. However, most of these damages can be removed instantaneously by dynamic annealing [12]. Generally speaking, the collision has three independent processes, including nuclear collision, electron collision, and charge exchange. Among of these, nuclear collision pertains to elastic collision, and the result is that abundant defects will be created. Electron collision refers to the collision between incident ions and electrons of the target material, and this collision process pertains to an inelastic collision process. During the electron collision process, electrons of target atoms will probably be excited. Another process is the charge exchange between incident ions and target atoms.